Please use this identifier to cite or link to this item:
|Title:||Plasma-Based Processes for Surface Wettability Modification|
|Authors:||LEJEUNE Michael; LACROIX Lise-Marie; BRETAGNOL FREDERIC; VALSESIA ANDREA; COLPO Pascal; ROSSI FRANCOIS|
|Citation:||LANGMUIR vol. 22 no. 7 p. 3057 -3061|
|Publisher:||American Chemical Society|
|Type:||Articles in periodicals and books|
|Abstract:||In this article, we describe a method to create rough features on silicon surfaces by reactive etching of a photoresist layer. The roughness and, consequently, the wettability of the surfaces can be modified by modifying the duration of plasma etching. Hydrophobic materials deposited on the rough silicon surface can be modified until a superhydrophobic behavior is obtained, whereas hydrophilic materials become more hydrophilic. The elaboration technique described herein offers an inexpensive and rapid method for the creation of tunable roughness on silicon surfaces with large areas.|
|JRC Institute:||Institute for Health and Consumer Protection|
Files in This Item:
There are no files associated with this item.
Items in repository are protected by copyright, with all rights reserved, unless otherwise indicated.