Title: Influence of Sputtering Pressure on Surface Structure and Oxygen Reduction Reaction Catalytic Activity of Thin Platinum Films
Citation: ELECTROCHIMICA ACTA vol. 55 no. 28 p. 8992-8997
Publication Year: 2010
JRC N°: JRC60383
ISSN: 0013-4686
URI: http://publications.jrc.ec.europa.eu/repository/handle/JRC60383
DOI: 10.1016/j.electacta.2010.08.047
Type: Articles in periodicals and books
Abstract: The work presents a study on the influence of the sputtering pressure on the surface structure and morphology of low Pt loaded electrodes and their electrochemical behaviour toward oxygen reduction reaction (orr) in sulphuric acid solution and polymer electrolyte membrane (Nafion 117). Pt was deposited as thin film upon hydrophobic carbon paper substrates at sputtering pressure varied in the range 2-13 Pa. The test samples are analysed by X-Ray diffraction (XRD) and scanning electron microscopy (SEM). The catalytic activity is assessed applying the methods of linear sweep voltammetry (LSV) on rotating disc electrode (RDE) and cyclic voltammetry (CV). The results obtained show strong influence of the sputtering pressure on the surface structure and crystal orientation which in turn, affects the orr efficiency. The best electrode performance in both electrolytes used is obtained for the Pt film deposited at pressure of 9 Pa. The results obtained in Nafion 117 show that catalyst utilisation in this electrode exceeds significantly the one for a commercial ELAT electrode at the same operation conditions. The research demonstrated that by simple variations in the sputter regime it is possible to optimise the catalysts morphology in order to increase the catalytic activity toward the electrochemical reaction of interest at the same time controlling precisely the required precious metal loading.
JRC Directorate:Energy, Transport and Climate

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