The goal of this research is to further develop the eDIM method based on a new application to some exemplary laptops, also referred to as notebooks, which is a product group that is under review for the Eco-design Directive. This study aims at evaluating the applicability of the eDIM method as a standardised method for the assessment of the ability to access or non-destructively remove and reassemble certain components/assemblies from products. The scope of this study is limited to non-destructive, also refered to as reversible, disassembly and reassembly for the purpose of repair, remanufacture and reuse.
In addition, the method has been further revised to address comments received from different stakeholders on the technical report outlining the eDIM method and during the presentation of the “Study for a method to assess the ease of disassembly of electrical and electronic equipment”. All comments received, which will be addressed in the presented study, relate to the following main topics:
- Applicability of the eDIM method to a broader range of products including small, portable electronics.
- Applicability of the eDIM method for other types of connectors, such as glues requiring wedge/pry and peel actions to be released
- Applicability of the eDIM method for partial disassembly, different levels of disassembly, reassembly and how to deal with the allocation of the (re)disassembly time for components that need to be disassembled sequentially.
- Applicability of the eDIM method to identify potential improvements for product’s designs.
PEETERS Jef;
TECCHIO Paolo;
ARDENTE Fulvio;
VANEGAS Paul;
COUGHLAN Damian;
DUFLOU Joost;
2018-03-08
Publications Office of the European Union
JRC107773
978-92-79-73190-7 (print),
978-92-79-73189-1,
1018-5593 (print),
1831-9424 (online),
EUR 28758 EN,
OP KJ-NA-28758-EN-C (print),
OP KJ-NA-28758-EN-N (online),
https://publications.jrc.ec.europa.eu/repository/handle/JRC107773,
10.2760/864982 (online),
10.2760/342832 (print),
