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dc.contributor.authorELOIRDI R.en_GB
dc.contributor.authorGOUDER Thomasen_GB
dc.contributor.authorWASTIN F.en_GB
dc.contributor.authorREBIZANT Jeanen_GB
dc.date.accessioned2010-02-25T14:47:16Z-
dc.date.available2003-11-04en_GB
dc.date.available2010-02-25T14:47:16Z-
dc.date.issued2004en_GB
dc.date.submitted2003-09-19en_GB
dc.identifier.citationJournal of Alloys and Compounds vol. 372 p. 10-16en_GB
dc.identifier.urihttp://publications.jrc.ec.europa.eu/repository/handle/JRC26176-
dc.description.abstractAbstract not availableen_GB
dc.description.sponsorshipJRC.E-Institute for Transuranium Elements (Karlsruhe)en_GB
dc.format.mediumPrinteden_GB
dc.languageENGen_GB
dc.relation.ispartofseriesJRC26176en_GB
dc.titleElectronic Structure of UxPd100-x Films Prepared by Sputter Co-Deposition.en_GB
dc.typeArticles in periodicals and booksen_GB
JRC Directorate:Nuclear Safety and Security

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