Plasma-Based Processes for Surface Wettability Modification
In this article, we describe a method to create rough features on silicon surfaces by reactive etching of a photoresist layer. The roughness and, consequently, the wettability of the surfaces can be modified by modifying the duration of plasma etching. Hydrophobic materials deposited on the rough silicon surface can be modified until a superhydrophobic behavior is obtained, whereas hydrophilic materials become more hydrophilic. The elaboration technique described herein offers an inexpensive and rapid method for the creation of tunable roughness on silicon surfaces with large areas.
LEJEUNE Michael;
LACROIX Lise-Marie;
BRETAGNOL Frederic;
VALSESIA Andrea;
COLPO Pascal;
ROSSI Francois;
2006-05-18
American Chemical Society
JRC33135
https://publications.jrc.ec.europa.eu/repository/handle/JRC33135,
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