Title: Plasma-Based Processes for Surface Wettability Modification
Citation: LANGMUIR vol. 22 no. 7 p. 3057 -3061
Publisher: American Chemical Society
Publication Year: 2006
JRC N°: JRC33135
URI: http://publications.jrc.ec.europa.eu/repository/handle/JRC33135
Type: Articles in periodicals and books
Abstract: In this article, we describe a method to create rough features on silicon surfaces by reactive etching of a photoresist layer. The roughness and, consequently, the wettability of the surfaces can be modified by modifying the duration of plasma etching. Hydrophobic materials deposited on the rough silicon surface can be modified until a superhydrophobic behavior is obtained, whereas hydrophilic materials become more hydrophilic. The elaboration technique described herein offers an inexpensive and rapid method for the creation of tunable roughness on silicon surfaces with large areas.
JRC Directorate:Institute for Health and Consumer Protection Historical Collection

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